{"id":11266,"date":"2024-03-22T05:40:35","date_gmt":"2024-03-22T09:40:35","guid":{"rendered":"https:\/\/tpack.pages.wm.edu\/?p=11266"},"modified":"2024-03-22T05:40:35","modified_gmt":"2024-03-22T09:40:35","slug":"11266","status":"publish","type":"post","link":"https:\/\/tpack.org\/tpackrefs\/archives\/11266","title":{"rendered":""},"content":{"rendered":"\n<p>Chai, C.S., Koh, E., Lim, C. P. &amp; Tsai, C.-C. (2014). \u00a0Deepening ICT integration through multilevel design of technological pedagogical content knowledge. <em>Journal of Computers in Education<\/em>, <em>1<\/em>, 1\u201317. <a href=\"https:\/\/doi.org\/10.1007\/s40692-014-0002-1\">https:\/\/doi.org\/10.1007\/s40692-014-0002-1<\/a><\/p>\n\n\n\n<p>Abstract:<\/p>\n\n\n\n<p>&#8220;This paper reflects upon the ICT integration efforts of the last two decades. It reviews major frameworks that have been employed to make sense of ICT integration, and argues for a more significant change among educators at all levels given the pervasiveness of ICT in today\u2019s society. An expanded version of the Technological Pedagogical Content Knowledge is proposed as a theoretical framework for creating new knowledge and innovative practices for ICT integration in educational settings.&#8221;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Chai, C.S., Koh, E., Lim, C. P. &amp; Tsai, C.-C. (2014). \u00a0Deepening ICT integration through multilevel design of technological pedagogical content knowledge. Journal of Computers in Education, 1, 1\u201317. https:\/\/doi.org\/10.1007\/s40692-014-0002-1 Abstract: &#8220;This paper reflects upon the ICT integration efforts of the last two decades. It reviews major frameworks that have&#8230;<\/p>\n<div class=\"more-link-wrapper\"><a class=\"more-link\" href=\"https:\/\/tpack.org\/tpackrefs\/archives\/11266\">Continue reading<span class=\"screen-reader-text\"><\/span><\/a><\/div>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3,15],"tags":[325,400,562,1979],"coauthors":[2300],"class_list":["post-11266","post","type-post","status-publish","format-standard","hentry","category-journal-article","category-published-literature-review","tag-teacher-knowledge","tag-literature-review","tag-technology-integration","tag-tpack-framework","entry"],"_links":{"self":[{"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/posts\/11266","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/comments?post=11266"}],"version-history":[{"count":0,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/posts\/11266\/revisions"}],"wp:attachment":[{"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/media?parent=11266"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/categories?post=11266"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/tags?post=11266"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/tpack.org\/tpackrefs\/wp-json\/wp\/v2\/coauthors?post=11266"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}